Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2006-10-31
2006-10-31
Walberg, Teresa J. (Department: 3753)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104330
Reexamination Certificate
active
07128134
ABSTRACT:
A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
REFERENCES:
patent: 5000256 (1991-03-01), Tousignant
patent: 5411077 (1995-05-01), Tousignant
patent: 5485671 (1996-01-01), Larson et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6227287 (2001-05-01), Tanaka et al.
patent: 6263959 (2001-07-01), Ikeda et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6317322 (2001-11-01), Ueki et al.
patent: 6840311 (2005-01-01), Ghosh et al.
patent: 6918431 (2005-07-01), Reyzin et al.
patent: 540983 (1992-07-01), None
Chen Chin-Ming
Huang Yu-Hung
Shih Jung-Sung
Wu Wei-Fang
Birch & Stewart Kolasch & Birch, LLP
Delta Electronics , Inc.
Walberg Teresa J.
LandOfFree
Heat dissipation module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3625530