Heat dissipation module

Details Heat dissipation module Heat dissipation module

2002-12-17

2004-11-16

Thompson, Gregory D. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C257S722000, C165S080300, C165S185000, C165S121000, C165S126000

Reexamination Certificate

active

06819564

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipation module, and in particular to a heat dissipation module for effectively cooling a CPU on a main board.
2. Description of the Related Art
Referring to
FIG. 1
, the conventional heat dissipation module
1
is composed of a fan
2
and a heat sink
4
with plural fins
6
formed thereon. According to the heat flow simulation analysis as shown in
FIG. 2
, the conventional heat dissipation module
1
has the following drawbacks.
(1) The airflow from the fan
2
flows through the heat sink
4
and flows out via opposite sides of the fins
6
. Obviously, there is no airflow passing through the central area A of the heat sink
4
. Thus, the efficiency of thermal exchange in the central area A is very low. The heat generated by the CPU
8
is concentrated on the central area A of the heat sink
4
and the spindle
22
of the fan
2
is located above the central area A. Thus, there is no airflow through the fins
6
in the central area A and the efficiency of heat dissipation of the conventional heat dissipation module
1
is enormously reduced.
(2) The heat sink
4
has a flat bottom and the airflow from the fan
2
flows downwardly to the flat bottom. Because of the short distance between the fan
2
and the heat sink
4
and the high density of the fins
6
, the airflow is subject to high back pressure. Thus, the amount of airflow from the fan
2
is decreased and the efficiency of heat dissipation of the conventional heat dissipation module
1
is reduced.
SUMMARY OF THE INVENTION
An object of the invention is to provide a heat dissipation module. The heat dissipation module comprises a base having a protruding portion having two slant surfaces; at least one fin assembly disposed on the slant surfaces of the protruding portion of the base; a cover, disposed over and covering the base; a fan, disposed on the cover. Besides, the protruding portion gradually shrinks toward said fan.
A detailed description will be given by the following embodiments with reference to the accompanying drawings.


REFERENCES:
patent: 5597034 (1997-01-01), Barker et al.
patent: 6196300 (2001-03-01), Checchetti
patent: 6382306 (2002-05-01), Hsu

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