Heat dissipation mechanism for power semiconductor elements

Details Heat dissipation mechanism for power semiconductor elements Heat dissipation mechanism for power semiconductor elements

1986-09-18

1988-03-22

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 15HP, 357 82, 165 804, 165 805, H01L 2346

Patent

active

047333316

ABSTRACT:
A power semiconductor column has power semiconductor elements arranged in alternation with thermally and electrically conductive evaporation blocks. Each evaporation block is connected in a separate heat-dissipating fluid circuit. Each fluid circuit has a heat exchanger connected to the corresponding evaporation block by way of a pair of flexible, electrically insulating fluid connections. Heat-carrying dielectric fluid circulates within each circuit between the evaporation block and the heat exchanger, cooling of the semiconductor elements being effected by evaporation of the fluid in the evaporation block and condensation of the fluid in the heat exchanger.

REFERENCES:
patent: 3989099 (1976-04-01), Hosono et al.
patent: 4020399 (1977-04-01), Suzuki et al.
patent: 4023616 (1977-05-01), Scherbaum
patent: 4614227 (1986-09-01), Vogel

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