Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2002-06-18
2004-10-26
Ciric, Ljiljana (Department: 3753)
Heat exchange
With retainer for removable article
Electrical component
C165S104210, C165S104330, C361S700000, C361S702000, C361S703000
Reexamination Certificate
active
06808013
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device which has a plurality of heat pipes surrounding a heat sink to form a closed circulation route.
2. Description of Prior Art
During operation of many heat generating devices such as central processing units (CPUs), large amounts of heat are produced. Such heat must be quickly removed from the heat generating device, to prevent it from becoming unstable or being damaged. Typically, a heat dissipation device is attached to an outer surface of a heat generating device to remove heat therefrom.
Referring to
FIG. 14
, a conventional heat dissipation device comprises a hollow chassis, working liquid received in the chassis, and a plurality of fins extending upwardly from the chassis. In operation, the chassis conductively absorbs heat from a heat generating device. The working liquid absorbs such heat, and then transfers the heat to the fins by phase transition, convection and circulation. However, convection of the working liquid within the chassis is often poor. As a result, the heat dissipation device cannot adequately dissipate heat from the heat generating device.
Referring to
FIG. 15
, another conventional heat dissipation device
20
comprises a metal block
26
, a heat pipe
21
and a plurality of parallel fins
22
. The metal block
26
is directly mounted on an outer surface of a heat generating device (not shown). One end of the heat pipe
21
is engaged in an aperture
23
of the metal block
26
, and an opposite end of the heat pipe
21
is extended through apertures
24
of the fins
22
to be in intimate thermal contact with the fins
22
. However, the thermal contact surface of the both ends of the heat pipe is limited. Accordingly, the heat removal capability of the heat dissipation device is frequently not sufficient.
Thus, an improved heat dissipation device which overcomes the above-mentioned problems is strongly desired.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat dissipation device which has a plurality of heat pipes surrounding a heat sink to attain great heat removal capability.
Another object of the present invention is to provide a heat dissipation device having simple and compact structure.
In order to achieve the objects set out above, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat sink, a plurality of first pipes, a pair of second pipes and working liquid. The heat sink comprises a base, and a plurality of fins attached on the base. A plurality of parallel first holes is defined through the base. A second hole is defined through a middle of the base in a longitudinal direction that is perpendicular to the first holes. The first and second pipes and the first and second holes thus cooperatively form a closed circulatory route. The working liquid is received in the circulatory route. In operation, the base absorbs heat from a heat generating electronic device. The working liquid absorbs some of that heat, and circulates through the circulatory route. Thus the first and second pipes dissipate said heat to airspace beyond the fins of the heat sink. Accordingly, the first and second pipes increase a heat dissipation area of the heat dissipation device. The heat removing capability of the heat dissipation device is optimized.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
REFERENCES:
patent: 1808617 (1931-06-01), Thompson
patent: 2992372 (1961-07-01), Himeon et al.
patent: 3669812 (1972-06-01), Ensslin
patent: 3768548 (1973-10-01), Dilay et al.
patent: 4079410 (1978-03-01), Schierz
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4562512 (1985-12-01), Sutrina
patent: 4724901 (1988-02-01), Munekawa
patent: 4733331 (1988-03-01), Chauvet
patent: 4931905 (1990-06-01), Cirrito et al.
patent: 5091824 (1992-02-01), Dzwonczyk
patent: 5285347 (1994-02-01), Fox et al.
patent: 5329993 (1994-07-01), Ettehadieh
patent: 5647430 (1997-07-01), Tajima
patent: 5829516 (1998-11-01), Lavochkin
patent: 5901037 (1999-05-01), Hamiilton et al.
patent: 5940270 (1999-08-01), Puckett
patent: 6053238 (2000-04-01), Goth et al.
patent: 6109337 (2000-08-01), Gomez
patent: 6137682 (2000-10-01), Ishimine et al.
patent: 6152213 (2000-11-01), Suzuki et al.
patent: 6252771 (2001-06-01), Jordan
patent: 6263957 (2001-07-01), Chen et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6397936 (2002-06-01), Crowley et al.
patent: 6591898 (2003-07-01), Chu et al.
patent: 6600649 (2003-07-01), Tsai et al.
Lai Cheng-Tien
Lee Tsung-Lung
Wang ShengHua
Chung Wei Te
Ciric Ljiljana
Hon Hai - Precision Ind. Co., Ltd.
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