Heat dissipation device with heat pipes

Details Heat dissipation device with heat pipes Heat dissipation device with heat pipes

2007-07-12

2010-06-29

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679520, C361S709000, C165S080400, C165S080500, C165S104330, C174S015200, C257S714000

Reexamination Certificate

active

07746640

ABSTRACT:
A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

REFERENCES:
patent: 2007/0074857 (2007-04-01), Xia et al.
patent: 2007/0215321 (2007-09-01), Yang et al.
patent: 2008/0093052 (2008-04-01), Yang et al.
patent: 2634657 (2004-08-01), None
patent: 1925734 (2007-03-01), None

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