Heat dissipation device with heat pipes

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C257S715000, C174S015200, C165S104210, C165S080400, C165S185000

Reexamination Certificate

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07548426

ABSTRACT:
A heat dissipation device includes a base (14) for absorbing heat from an electronic device and a plurality of fins (20) arranged on the base. A heat pipe (32) thermally contacts the fins and the base for transferring heat from the base to the fins. The heat pipe includes a U-shaped section thermally mounted below the base for absorbing the heat from the electronic device, two straight sections thermally engaging with the fins, and two arced sections interconnecting the U-shaped section and corresponding straight sections. The heat pipe is integrally formed by bending a straight heat pipe and functions as two U-shaped, individual heat pipes.

REFERENCES:
patent: 6808013 (2004-10-01), Lai et al.
patent: 7051792 (2006-05-01), Lee et al.
patent: 7089999 (2006-08-01), Wu et al.
patent: 7100681 (2006-09-01), Wu et al.
patent: 2006/0104032 (2006-05-01), Lee et al.
patent: 2007/0000646 (2007-01-01), Chen et al.
patent: 2007/0006997 (2007-01-01), Hsieh
patent: 2007/0137846 (2007-06-01), Wang et al.
patent: 2007/0147006 (2007-06-01), Peng
patent: 2007/0217153 (2007-09-01), Lai et al.
patent: 2007/0267177 (2007-11-01), Lin et al.
patent: 2007/0267181 (2007-11-01), Lin et al.
patent: 2008/0028610 (2008-02-01), Chen
patent: 2008/0047693 (2008-02-01), Chen
patent: 101115368 (2006-07-01), None

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