Heat dissipation device with heat pipes

Details Heat dissipation device with heat pipes Heat dissipation device with heat pipes

2006-07-24

2008-11-18

Leo, Leonard R (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C361S700000

Reexamination Certificate

active

07451806

ABSTRACT:
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.

REFERENCES:
patent: 6321452 (2001-11-01), Lin
patent: 6542364 (2003-04-01), Lai et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 7254019 (2007-08-01), Leu et al.
patent: 7278470 (2007-10-01), Xia et al.
patent: 7343962 (2008-03-01), Xia et al.
patent: 2007/0000646 (2007-01-01), Chen et al.
patent: 2007/0074857 (2007-04-01), Xia et al.
patent: 2007/0215321 (2007-09-01), Yang et al.

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