Heat dissipation device with heat pipe

Details Heat dissipation device with heat pipe Heat dissipation device with heat pipe

2008-05-12

2009-11-03

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S679470, C361S679520, C361S699000, C361S719000, C165S080300, C165S080400, C165S104330

Reexamination Certificate

active

07613001

ABSTRACT:
A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.

REFERENCES:
patent: 7079394 (2006-07-01), Mok
patent: 7286357 (2007-10-01), Wung et al.
patent: 7325590 (2008-02-01), Kim et al.
patent: 7369412 (2008-05-01), Peng et al.
patent: 7495920 (2009-02-01), Chen et al.
patent: 2006/0162901 (2006-07-01), Aizono et al.
patent: 2009/0122480 (2009-05-01), Chou et al.

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