Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-25
2007-12-25
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S710000, C165S104330, C165S185000, C248S510000
Reexamination Certificate
active
11189496
ABSTRACT:
The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.
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Taiwan Office Action mailed Oct. 31, 2006.
Chien Tsan-Nan
Huang Yu-Nien
Liu Yu
Tseng Jim-Fat
Wang Cheng-Yu
Gandhi Jayprakash
Hoffberg Robert J
Quanta Computer Inc.
Thomas Kayden Horstemeyer & Risley
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