Heat-dissipation device with elastic member and...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S710000, C165S104330, C165S185000, C248S510000

Reexamination Certificate

active

11189496

ABSTRACT:
The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.

REFERENCES:
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4246597 (1981-01-01), Cole et al.
patent: 6301107 (2001-10-01), Lev et al.
patent: 6328097 (2001-12-01), Bookhardt et al.
patent: 6345664 (2002-02-01), Katsui
patent: 6347036 (2002-02-01), Yeager et al.
patent: 6366460 (2002-04-01), Stone et al.
patent: 6400565 (2002-06-01), Shabbir et al.
patent: 6442025 (2002-08-01), Nakamura et al.
patent: 6504720 (2003-01-01), Furuya
patent: 6570761 (2003-05-01), Stone et al.
patent: 6708754 (2004-03-01), Wei
patent: 6883594 (2005-04-01), Sarraf et al.
patent: 200501366 (2006-06-01), None
Taiwan Office Action mailed Oct. 31, 2006.

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