Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-25
2007-12-25
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S702000, C361S704000, C361S709000, C165S080400, C165S104330, C165S185000
Reexamination Certificate
active
11244688
ABSTRACT:
A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
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Chen Chun-Chi
Du Hong-Wei
Lee Hsieh-Kun
Wu Zhan
Zhou Bing-Wen
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shenzhen) Co., Ltd.
Gandhi Jayprakash
Hoffberg Robert J.
Morris Manning & Martin LLP
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