Heat dissipation device of electronic circuit modules

Details Heat dissipation device of electronic circuit modules Heat dissipation device of electronic circuit modules

2011-03-08

2011-03-08

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C361S719000, C257S712000, C257S721000, C174S016100

Reexamination Certificate

active

07903408

ABSTRACT:
A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.

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