Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-02
2007-10-02
Chèrvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C361S700000, C174S135000, C174S0720TR, C439S067000, C439S247000, C439S485000, C439S487000, C415S213100, C415S214100, C165S104330, C165S104210, C165S080300, C165S080400
Reexamination Certificate
active
11308837
ABSTRACT:
A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires (20) therein. The heat dissipation device includes a heat sink assembly. A wire fixture (60) is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate (62) positioned on the heat sink assembly. A bridge (624) projects from the mounting plate to form a receiving room (625) below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.
REFERENCES:
patent: 5562410 (1996-10-01), Sachs et al.
patent: 6062872 (2000-05-01), Strange et al.
patent: 6388196 (2002-05-01), Liu et al.
patent: 6435889 (2002-08-01), Vinson et al.
patent: 6663416 (2003-12-01), Huang et al.
patent: 6951446 (2005-10-01), Hung
patent: 6964295 (2005-11-01), Yu et al.
patent: 6989988 (2006-01-01), Arbogast et al.
patent: 7033206 (2006-04-01), Chang et al.
patent: 2005/0225939 (2005-10-01), Otsuki et al.
patent: 2006/0032616 (2006-02-01), Yang
patent: 2006/0137861 (2006-06-01), Wang et al.
patent: 2006/0268513 (2006-11-01), Sheng et al.
patent: 2007/0035926 (2007-02-01), Xia et al.
Chen Qiao
Feng Jin-Song
Lu Cui-Jun
Chervinsky Boris
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Knapp Jeffrey T.
Smith Courtney
LandOfFree
Heat dissipation device having wire fixture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation device having wire fixture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device having wire fixture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3874082