Heat dissipation device having heat pipes for supporting...

Details Heat dissipation device having heat pipes for supporting... Heat dissipation device having heat pipes for supporting...

2007-12-29

2011-11-01

Leo, Leonard (Department: 3785)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C361S700000

Reexamination Certificate

active

08047270

ABSTRACT:
A heat dissipation device includes a base, a fin group located at a top of the base, a fan mounted on a top of the fin group, a first heat pipe and a second heat pipe. The first and second heat pipes connect with the base and the fin group and each includes a condensing portion and an evaporating portion. The evaporating portions of the first and second heat pipes are received in the base. The condensing portions of the first and the second heat pipes are located at opposite sides of the fin group respectively and extend through and support the fin group along opposite directions.

REFERENCES:
patent: 6394175 (2002-05-01), Chen et al.
patent: 6958915 (2005-10-01), Wang et al.
patent: 7013960 (2006-03-01), Lee et al.
patent: 7028758 (2006-04-01), Sheng et al.
patent: 2003/0019610 (2003-01-01), Liu
patent: 2004/0165350 (2004-08-01), Fan
patent: 2006/0120044 (2006-06-01), Yu et al.
patent: 2006/0238982 (2006-10-01), Lee et al.
patent: 2006/0262504 (2006-11-01), Xia et al.

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