Heat dissipation device having a fan mounted thereon

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S697000, C361S679480, C361S679540, C361S695000, C361S704000, C361S709000, C165S080300, C165S185000, C174S016100, C174S016300, C248S510000, C415S213100

Reexamination Certificate

active

07639497

ABSTRACT:
A heat dissipation device for dissipating heat from a heat-generating electronic element includes a heat sink for contacting with the heat-generating electronic element, a fan placed on the heat sink for providing an airflow through the heat sink and two wire clips. The fan comprises a frame. Each wire clip comprises a V-shaped main body and two locking parts at two opposite ends of the main body. Middles of the main bodies of the two wire clips are securely attached to two lateral sides of the heat sink by two screws. The locking parts of the wire clips are fastened to the frame of the fan, with the main bodies being deformed and pushing the fan toward the heat sink.

REFERENCES:
patent: 5509465 (1996-04-01), Lai
patent: 5678627 (1997-10-01), Lee
patent: 6308773 (2001-10-01), Lin
patent: 6435467 (2002-08-01), Lai
patent: 6460609 (2002-10-01), Cho et al.
patent: 6579062 (2003-06-01), Lu et al.
patent: 6598666 (2003-07-01), Lin
patent: 6654246 (2003-11-01), Wu
patent: 6749398 (2004-06-01), Lu et al.
patent: 6865079 (2005-03-01), Yu
patent: 7301769 (2007-11-01), Li et al.
patent: D567772 (2008-04-01), Lin et al.
patent: 7365975 (2008-04-01), Xia et al.
patent: 7423873 (2008-09-01), Shuai et al.
patent: 2002/0075653 (2002-06-01), Lin
patent: 2004/0000398 (2004-01-01), Lee et al.
patent: 201064045 (2008-05-01), None
patent: 2003033422 (2003-05-01), None

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