Heat dissipation device for multiple heat-generating components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S698000, C361S702000, C361S703000, C361S709000

Reexamination Certificate

active

11266044

ABSTRACT:
A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (14) and the second heat sink comprises a plurality of second heat dissipation fins (24). Each heat pipe comprises an evaporating portion (32) and a condensing portion (34). The evaporating portions of two heat pipes thermally engage in a base of the first heat sink and the condensing portions thereof connect the first and second heat dissipation fins. The evaporating portions of the other two heat pipes thermally engage in a base of the second heat sink and the condensing portions thereof connect the second and first heat dissipation fins.

REFERENCES:
patent: 6487076 (2002-11-01), Wang
patent: 6600649 (2003-07-01), Tsai et al.
patent: 6903930 (2005-06-01), DiStefano et al.
patent: 6909608 (2005-06-01), Fan
patent: 6918429 (2005-07-01), Lin et al.
patent: 7013960 (2006-03-01), Lee et al.
patent: 7019974 (2006-03-01), Lee et al.
patent: 7028758 (2006-04-01), Sheng et al.
patent: 7100681 (2006-09-01), Wu et al.
patent: 2004/0112583 (2004-06-01), Garner et al.
patent: 2004/0165350 (2004-08-01), Fan
patent: 2005/0092465 (2005-05-01), Lin et al.
patent: 2005/0103476 (2005-05-01), Chen et al.
patent: 2005/0141198 (2005-06-01), Lee et al.
patent: 2005/0241808 (2005-11-01), Lee et al.
patent: 2005/0247437 (2005-11-01), Ying et al.
patent: 2005/0263265 (2005-12-01), Sheng et al.
patent: 2006/0032617 (2006-02-01), Chen et al.
patent: 2006/0054307 (2006-03-01), Lee et al.
patent: 2006/0291172 (2006-12-01), Lee et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipation device for multiple heat-generating components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device for multiple heat-generating components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device for multiple heat-generating components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3858537

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.