Heat dissipation device for LED chips

Details Heat dissipation device for LED chips Heat dissipation device for LED chips

2011-07-19

2011-07-19

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257S098000, C257S103000, C257SE33001, C165S080300

Reexamination Certificate

active

07982225

ABSTRACT:
A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

REFERENCES:
patent: 2007/0090737 (2007-04-01), Hu et al.
patent: 1953164 (2007-04-01), None

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