Heat dissipation device for integrated circuits

Details Heat dissipation device for integrated circuits Heat dissipation device for integrated circuits

2000-07-17

2002-07-02

Atkinson, Christopher (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S185000, C257S719000, C257S722000, C361S704000, C411S339000, C411S509000, C411S510000, C411S525000, C411S526000

Reexamination Certificate

active

06412546

ABSTRACT:

BACKGROUND
1. Field of the Invention
The present invention relates to a heat dissipation device, and particularly to a heat dissipation device which is readily attached to an integrated circuit.
2. The Related Art
A heat sink is usually mounted in contact with an integrated circuit (IC) for transferring heat through conduction therefrom. Various means have been developed for securing heat sinks to integrated circuits. Adhesive is generally used to attach heat sinks to integrated circuits. However, when attached to an integrated circuit by adhesive, a heat sink may peel off during transportation. Besides, heat sinks attached by adhesive cannot be removed from the integrated circuit for repair or replacement.
To counter the above problem, fastening members have been used in place of adhesives for securing heat sinks to integrated circuits. For example, referring to
FIGS. 6 and 7
, a heat sink
20
is mounted to an integrated circuit
40
by a plurality of pins
10
. The heat sink
20
has a flat base
26
that defines a plurality of holes
28
therethrough for receiving the pins
10
, and a plurality of fins
24
projecting upwardly from the top face thereof. Each pin
10
comprises a cylindrical head
12
, a shaft body
14
and an insertion end
16
. A spring
18
is disposed around the shaft body
14
. The pin
10
is preferably formed with a narrow opening
22
laterally penetrating the insertion end
16
and extending into a portion of the shaft body
14
thereby providing compressive resiliency in the radial direction. In assembly, each pin
10
is inserted through the corresponding hole
28
in the flat base
26
of the heat sink
20
and engages the insertion end
16
thereof with a corresponding hole
32
defined in a printed circuit board
30
for securing the heat sink
20
to the chip
40
. However, the size of the corresponding hole
32
in the printed circuit board
30
must be large enough to accommodate the shaft body
14
and the insertion end
16
of the pin
10
. Therefore, the holes
32
occupy too much area on the printed circuit board
30
. Additionally, although the pins
10
are releasable, the operation of releasing the pins
10
under the printed. circuit board
30
is inconvenient.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat dissipation device having an assembling device allowing simple and ready attachment/detachment of the heat dissipation device to/from an integrated circuit.
Another object of the present invention is to provide a heat dissipation device having an assembling device that occupies a relatively small area of a printed circuit board.
To achieve the above-mentioned objects, a heat dissipation device in accordance with the present invention comprises a heat sink and an assembling device for securing the heat sink to a chip mounted on a printed circuit board. The heat sink has a pair of ears each defining an aperture therein. The assembling device includes a clip and a pair of sleeves wherein each sleeve defines a cavity extending therethrough. The sleeves are respectively inserted through the apertures of the ears of the heat sink, a pair of springs respectively being disposed between the ears and an end of the sleeves. The clip has a pair of posts for extending through the printed circuit board to engage with the corresponding cavities.
Other objects, advantages and novel features of the present invention will be apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings, in which:


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