Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-04
2007-09-04
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S709000, C361S800000, C361S816000, C361S818000, C165S104330
Reexamination Certificate
active
11357973
ABSTRACT:
A heat sink is attached to fixing plates of a shield case. When a circuit board is covered by the shield case, the heat sink comes into contact with a circuit component mounted on the circuit board through a heat conduction sheet. Further, clearance holes, which are approximately closed by first heat dissipation plates, are formed to the shield case.
REFERENCES:
patent: 5060114 (1991-10-01), Feinberg et al.
patent: 5384940 (1995-01-01), Soule et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5581443 (1996-12-01), Nakamura et al.
patent: 5604665 (1997-02-01), Chrysler et al.
patent: 5784256 (1998-07-01), Nakamura et al.
patent: 6025991 (2000-02-01), Saito
patent: 6357514 (2002-03-01), Sasaki et al.
patent: 6445583 (2002-09-01), Kline et al.
patent: 6545871 (2003-04-01), Ramspacher et al.
patent: 6673998 (2004-01-01), Wu
patent: 7061773 (2006-06-01), Chen
patent: 2002/0154487 (2002-10-01), Weischhof fVan Rijn
patent: 2004/0190206 (2004-09-01), Ookawa et al.
patent: 2004/0190260 (2004-09-01), Sasaki
patent: 2006/0176672 (2006-08-01), Kamemoto et al.
patent: 2006/0187643 (2006-08-01), Tsurufusa
patent: 7-30280 (1995-01-01), None
patent: 7-226466 (1995-08-01), None
patent: 08279689 (1996-10-01), None
patent: 9-64582 (1997-03-01), None
patent: 2002190684 (2002-07-01), None
patent: 2002-359380 (2002-12-01), None
patent: 2002368481 (2002-12-01), None
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Gandhi Jayprakash
Hoffberg Robert J.
Kabushiki Kaisha Toshiba
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