Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface
Reexamination Certificate
2006-10-10
2006-10-10
Heitbrink, Tim (Department: 1722)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
Shaping against forming surface
C264S328150, C425S547000, C425S549000
Reexamination Certificate
active
07118703
ABSTRACT:
An injection molding apparatus comprises a manifold having a manifold channel for receiving a melt stream of moldable material under pressure. A nozzle having a nozzle channel receives the melt stream from the manifold channel and delivers the melt stream through a mold gate to a mold cavity. The nozzle includes a nozzle head, a nozzle body and a nozzle tip. A heat dissipation device is coupled to the nozzle body at a location between the nozzle head and the nozzle tip to regulate the temperature of the nozzle and maintain it within a predetermined temperature range.
REFERENCES:
patent: 4439915 (1984-04-01), Gellert
patent: 4557685 (1985-12-01), Gellert
patent: 4648546 (1987-03-01), Gellert
patent: 4688622 (1987-08-01), Gellert
patent: 5125827 (1992-06-01), Gellert
patent: 5360333 (1994-11-01), Schmidt
patent: 5411392 (1995-05-01), Von Buren
patent: 6447283 (2002-09-01), Gellert
patent: 6936199 (2005-08-01), Olaru
patent: 6992269 (2006-01-01), Renwick et al.
patent: 2002-331552 (2002-11-01), None
patent: WO 95/00312 (1995-01-01), None
patent: WO 03/80315 (2003-10-01), None
S.L. Folkman et al., “Characterization of electroless nickel plating on aluminum mirrors,” Proceedings of SPIE, Optomechanical Design and Engineering 2002, vol. 4771, p. 254, Jul. 7-9, 2002.
E.A. Wachter et al., “Remote Optical Detection Using Microcantilevers,” Rev. Sci. Instrum. vol. 67, No. 10, pp. 3434-3439 (Oct. 1996).
Heitbrink Tim
Mold-Masters Limited
LandOfFree
Heat dissipation device for and method of dissipating heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation device for and method of dissipating heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device for and method of dissipating heat... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3714813