Heat dissipation device for a computer mother board

Details Heat dissipation device for a computer mother board Heat dissipation device for a computer mother board

2007-02-20

2007-02-20

Lea-Edmonds, Lisa (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S707000, C361S710000, C257S713000

Reexamination Certificate

active

11139561

ABSTRACT:
A heat dissipation device for a computer mother board includes a computer enclosure, a heat sink and a mother board. The computer enclosure includes a frame, front and rear panels, two side panels and top and bottom panels respectively connecting to the frame. One side panel is disposed with a support board at the inner side thereof. The heat sink is fixed to one surface of the support board and between the support board and the side panel. The mother board is connected to the other surface of the support board. A plurality of connectors and electronic modules are disposed at one side of the mother board and heat generation modules including a CPU and an electronic chip are disposed at the other side of the mother board. The heat generation modules are in thermal contact with the heat sink.

REFERENCES:
patent: 6249428 (2001-06-01), Jeffries et al.
patent: 6320776 (2001-11-01), Kajiura et al.
patent: 6504719 (2003-01-01), Konstad et al.
patent: 6542362 (2003-04-01), Lajara et al.

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