Heat dissipation device and power module

Details Heat dissipation device and power module Heat dissipation device and power module

2011-06-14

2011-06-14

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S703000, C361S709000, C361S710000, C361S711000, C165S080200, C165S080400, C165S151000, C165S152000, C165S174000

Reexamination Certificate

active

07961474

ABSTRACT:
A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.

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