Heat dissipation device and fan module thereof

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S690000, C361S694000, C415S213100, C312S236000, C454S186000

Reexamination Certificate

active

07450379

ABSTRACT:
A heat dissipation device and fan module. The fan module is fixed to a fan tray, which has a track with a first engaging portion. A securing member is disposed on a shield, comprising a second engaging portion. The second engaging portion enters the first engaging portion, fixing the fan module to the fan tray. An actuator connects the securing member and the shield. When external force deforms the actuator, the securing member deforms therewith, withdrawing the second engaging portion from the first engaging portion.

REFERENCES:
patent: 4575038 (1986-03-01), Moore
patent: 4972294 (1990-11-01), Moses et al.
patent: 5138524 (1992-08-01), Smithers
patent: 5208730 (1993-05-01), Tracy
patent: 5788566 (1998-08-01), McAnally et al.
patent: 6031719 (2000-02-01), Schmitt et al.
patent: 6040981 (2000-03-01), Schmitt et al.
patent: 6236564 (2001-05-01), Fan
patent: 6556437 (2003-04-01), Hardin
patent: 6633486 (2003-10-01), Coles et al.
patent: 6639796 (2003-10-01), Cannon
patent: 6665908 (2003-12-01), Mease
patent: 6674641 (2004-01-01), Jensen et al.
patent: 6731502 (2004-05-01), Hsu
patent: 6839233 (2005-01-01), Cravens et al.
patent: 6865078 (2005-03-01), Chang
patent: 6961248 (2005-11-01), Vincent et al.
patent: 6970353 (2005-11-01), Brovald et al.
patent: 2003/0011985 (2003-01-01), Jensen et al.
patent: 2004/0130872 (2004-07-01), Cravens et al.
patent: 2005/0024832 (2005-02-01), Lee et al.

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