Heat dissipation device and electronic device with the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S121000, C415S213100, C415S214100, C417S423700, C361S694000

Reexamination Certificate

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07613000

ABSTRACT:
A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).

REFERENCES:
patent: 6388196 (2002-05-01), Liu et al.
patent: 7277281 (2007-10-01), Lu et al.
patent: 2005/0141193 (2005-06-01), Otsuki et al.
patent: 2005/0225939 (2005-10-01), Otsuki et al.
patent: 2005/0253467 (2005-11-01), Watanabe et al.
patent: 2007/0029071 (2007-02-01), Hwang et al.
patent: 2008/0023176 (2008-01-01), Peng et al.
patent: 2008/0152489 (2008-06-01), Alex et al.

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