Heat dissipation device

Details Heat dissipation device Heat dissipation device

2007-10-10

2009-10-06

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C361S697000, C361S719000, C361S720000, C361S721000, C165S080300, C174S016100, C174S016300

Reexamination Certificate

active

07599182

ABSTRACT:
An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the CPU, a fan attached to the heat sink, and an air guide member attached to the second electronic element. The air guide member includes a guiding portion to guide air from the fan to the second electronic element.

REFERENCES:
patent: 5763950 (1998-06-01), Fujisaki et al.
patent: 6364009 (2002-04-01), MacManus et al.
patent: 6778390 (2004-08-01), Michael
patent: 7120018 (2006-10-01), Shen et al.
patent: 7382616 (2008-06-01), Stefanoski
patent: 7397665 (2008-07-01), Yuval

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