Heat dissipation device

Details Heat dissipation device Heat dissipation device

2007-08-09

2009-02-17

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S104330, C361S719000

Reexamination Certificate

active

07492596

ABSTRACT:
A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.

REFERENCES:
patent: 6937474 (2005-08-01), Lee
patent: 7019974 (2006-03-01), Lee et al.
patent: 7209356 (2007-04-01), Lee et al.
patent: 7319588 (2008-01-01), Peng et al.
patent: 7327576 (2008-02-01), Lee et al.
patent: 7369412 (2008-05-01), Peng et al.
patent: 2008/0035311 (2008-02-01), Hsu

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