Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-12
2009-10-20
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C257S719000
Reexamination Certificate
active
07606030
ABSTRACT:
A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
REFERENCES:
patent: 3851221 (1974-11-01), Beaulieu et al.
patent: 6104611 (2000-08-01), Glover et al.
patent: 7130193 (2006-10-01), Hirafuji et al.
patent: 7142422 (2006-11-01), Lee et al.
patent: 7265981 (2007-09-01), Lee
patent: 7342795 (2008-03-01), Lee et al.
patent: 2006/0126309 (2006-06-01), Bolle et al.
patent: 2006/0262506 (2006-11-01), Lee et al.
patent: 2007/0086170 (2007-04-01), Liang
patent: 2007/0263355 (2007-11-01), Yu et al.
Chen Chun-Chi
Chen Guo
Zhou Shi-Wen
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
Thompson Gregory D
LandOfFree
Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4072245