Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-04-24
2008-08-19
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S719000, C165S121000
Reexamination Certificate
active
07414842
ABSTRACT:
A heat dissipation device includes a heat sink with a plurality of fins, a fan mounted on a side of the heat sink with a space formed between the heat sink and the fan, and at least one airflow guiding board formed by one end of at least one of the fins. The airflow guiding board extends through the space to connect with the fan. The airflow guiding board can guide the airflow generated by the fan to the heat sink, so as to reduce the loss of the airflow from the edge of the heat sink, and enhance the effect of heat dissipation. Alternatively, the airflow guide board can also function to guide the airflow to cool other heat sinks.
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Chen Chin-Lung
Hao Ming-Liang
Lin Yeu-Lih
Yang Ming
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Thompson Gregory D
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