Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-27
2008-08-19
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C257S721000, C257S718000, C257S719000, C257S727000, C165S080300
Reexamination Certificate
active
07414847
ABSTRACT:
A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.
REFERENCES:
patent: 4745456 (1988-05-01), Clemens
patent: 6648664 (2003-11-01), McHugh et al.
patent: 6672892 (2004-01-01), Chandran et al.
patent: 6678160 (2004-01-01), Liu
patent: 6731506 (2004-05-01), Dong et al.
patent: 7079401 (2006-07-01), Lee et al.
patent: 7283361 (2007-10-01), Lee et al.
Li Tao
Tian Wei-Qiang
Xia Wan-Lin
Chervinsky Boris L
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
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