Heat dissipation device

Details Heat dissipation device Heat dissipation device

2008-03-18

2008-03-18

Chėrvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S709000, C165S080300, C165S185000, C257S712000

Reexamination Certificate

active

11308847

ABSTRACT:
A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

REFERENCES:
patent: 6307747 (2001-10-01), Farnsworth et al.
patent: 6992895 (2006-01-01), Lindberg
patent: 7117929 (2006-10-01), Curtis et al.
patent: 7142427 (2006-11-01), Reents
patent: 7154751 (2006-12-01), Furuyama et al.
patent: 2006/0126305 (2006-06-01), Xia et al.

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