Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-06
2008-05-06
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S698000, C361S699000, C361S700000, C361S719000, C165S080400, C165S104210, C165S104330
Reexamination Certificate
active
11308775
ABSTRACT:
A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.
REFERENCES:
patent: 5331510 (1994-07-01), Ouchi et al.
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5946191 (1999-08-01), Oyamada
patent: 5986882 (1999-11-01), Ekrot et al.
patent: 6055157 (2000-04-01), Bartilson
patent: 6538884 (2003-03-01), Wong et al.
patent: 6671177 (2003-12-01), Han
patent: 6717811 (2004-04-01), Lo et al.
patent: 6937474 (2005-08-01), Lee
patent: 7019974 (2006-03-01), Lee et al.
patent: 7177154 (2007-02-01), Lee
patent: 2005/0122686 (2005-06-01), Oyamada
patent: 2006/0164808 (2006-07-01), Stefanoski
patent: 2718653 (2005-08-01), None
patent: 20044297024 (2004-10-01), None
patent: M267834 (2005-06-01), None
patent: 200534081 (2005-10-01), None
The article: “Cooling System for Chip Carrier on Card”, IBM Technical Disclosure Bulletin, Sep. 1988, vol. 31, Issue 4, pp. 39-40.
Chen Rui-Hua
Peng Xue-Wen
Datskovskiy Michael
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
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