Heat dissipation device

Details Heat dissipation device Heat dissipation device

2008-04-29

2008-04-29

Walberg, Teresa J. (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S104330, C165S126000

Reexamination Certificate

active

11166487

ABSTRACT:
A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake and an outlet. A fan is located adjacent to the intakes and provides airflow entering the channels through the intakes and leaving the channels through the outlets. A first guiding member is located adjacent to the outlets. The airflow out of the outlets is guided, by the first guiding member, to be deflected towards the substrate for cooling other electronic devices neighboring the one contacting with the base.

REFERENCES:
patent: 5975194 (1999-11-01), Wagner
patent: 6382306 (2002-05-01), Hsu
patent: 6450251 (2002-09-01), Lin et al.
patent: 6538888 (2003-03-01), Wei et al.
patent: 2003/0192670 (2003-10-01), North et al.
patent: 495133 (2002-07-01), None
patent: 532758 (2003-05-01), None

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