Heat dissipation device

Details Heat dissipation device Heat dissipation device

2007-04-24

2007-04-24

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S704000, C165S080300, C257S718000

Reexamination Certificate

active

11132584

ABSTRACT:
A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.

REFERENCES:
patent: 5689654 (1997-11-01), Kikinis et al.
patent: 5898568 (1999-04-01), Cheng
patent: 5898569 (1999-04-01), Bhatia
patent: 5953211 (1999-09-01), Donahoe et al.
patent: 5963887 (1999-10-01), Giorgio
patent: 6104607 (2000-08-01), Behl
patent: 6396693 (2002-05-01), Shih
patent: 6906922 (2005-06-01), Yu et al.
patent: 6909602 (2005-06-01), Dietrich et al.
patent: 6922787 (2005-07-01), Karpel et al.
patent: 2004/0226695 (2004-11-01), Bolle et al.
patent: 2005/0248918 (2005-11-01), Lin

Affiliated with

Also associated with

Rating

Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3766540