Heat dissipation device

Details Heat dissipation device Heat dissipation device

2007-09-11

2007-09-11

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S709000, C361S720000, C165S080300, C165S104330

Reexamination Certificate

active

11308280

ABSTRACT:
A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spreader and an upper base plate (34) with a plurality of first fins (36) extending downwardly from the upper base plate towards the lower base plate and a connecting portion (33) interconnecting the lower and upper base plate. A plurality of second fins (38) is mounted on the conducting member. A plurality of heat pipes (40) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan (20) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.

REFERENCES:
patent: 6189601 (2001-02-01), Goodman et al.
patent: 7110259 (2006-09-01), Lee et al.
patent: 2005/0141198 (2005-06-01), Lee et al.
patent: 2005/0183849 (2005-08-01), Ko et al.
patent: 2005/0247437 (2005-11-01), Ying et al.
patent: 2006/0054307 (2006-03-01), Lee et al.

Affiliated with

Also associated with

Rating

Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3751601