Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-28
2006-11-28
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S704000, C257S706000, C257S712000, C257S714000, C257S715000, C257S718000, C174S015100, C174S015200, C174S016100, C174S016300, C165S080300, C165S080400, C165S104330
Reexamination Certificate
active
07142422
ABSTRACT:
A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.
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Lee Hsieh Kun
Liu He-Ben
Xia Wan-Lin
Chervinsky Boris
Chung Wei Te
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shenzhen) Co., Ltd.
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