Heat dissipation device

Details Heat dissipation device Heat dissipation device

2006-03-28

2006-03-28

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C174S015200, C165S080400, C165S104210, C257S715000

Reexamination Certificate

active

07019974

ABSTRACT:
A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

REFERENCES:
patent: 4830100 (1989-05-01), Kato et al.
patent: 5229915 (1993-07-01), Ishibashi et al.
patent: 5930115 (1999-07-01), Tracy et al.
patent: 6181556 (2001-01-01), Allman
patent: 6914780 (2005-07-01), Shanker et al.
patent: 2003/0189815 (2003-10-01), Lee

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