Heat dissipation device

Details Heat dissipation device Heat dissipation device

2006-03-21

2006-03-21

McKinnon, Terrell (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104210, C165S080300, C361S697000, C361S700000, C257S715000, C174S015200

Reexamination Certificate

active

07013960

ABSTRACT:
A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of fins (24). The second heat sink is located above and faced to the first heat sink. At least one fin (15) of the first heat sink forms a bifurcated portion (152) at an upper section thereof. A corresponding fin (25) of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.

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