Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2005-11-15
2005-11-15
McKinnon, Terrell (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C165S080400, C361S697000, C361S700000, C257S715000
Reexamination Certificate
active
06964295
ABSTRACT:
A heat dissipating device assembly includes a heat receiver, a heat sink defining two opposite ends and a plurality of channels formed between the two opposite ends, a fin member cooperating with the heat receiver to enclose the heat sink except the two opposite ends, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan provided adjacent one of the two opposite ends for creating airflow to flow through the channels of the heat sink. The fin member includes a plurality of fins formed at the outer surface thereof for increasing heat dissipating surface of the heat dissipating device assembly.
REFERENCES:
patent: 5742478 (1998-04-01), Wu
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6542364 (2003-04-01), Lai et al.
patent: 6702002 (2004-03-01), Wang
patent: 6745824 (2004-06-01), Lee et al.
patent: 6779595 (2004-08-01), Chiang
patent: 2003/0019610 (2003-01-01), Liu
patent: 2004/0226697 (2004-11-01), Liu
patent: 2004/0244948 (2004-12-01), Luo
patent: 2005/0067144 (2005-03-01), Chou
patent: 521844 (2003-02-01), None
patent: 535938 (2003-06-01), None
patent: 540983 (2003-07-01), None
patent: 542374 (2003-07-01), None
patent: 543828 (2003-07-01), None
Lee Hsieh-Kun
Lu Cui-Jun
Yu Guang
HON HAI Precision Industry Co., Ltd.
McKinnon Terrell
Morris Manning & Martin
Tingkang Xia, Esq. Tim
LandOfFree
Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3470590