Heat dissipation device

Details Heat dissipation device Heat dissipation device

2003-01-14

2004-11-09

Thompson, Gregory D. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C165S121000, C165S125000, C174S016300, C257S719000, C257S722000, C361S704000, C361S710000, C361S703000, C361S695000

Reexamination Certificate

active

06816373

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to heat dissipation devices, and more particularly to a heat dissipation device which is attached to an electronic package to remove heat therefrom.
2. Description of Prior Art
With the rapid development of electronics technology, electronic packages such as CPUs are able to process signals at unprecedented high speeds. As a result, CPUs can generate copious amounts of heat. The heat must be efficiently removed from the CPU; otherwise, abnormal operation or damage may result. Heat dissipation devices are attached to the CPU to remove heat therefrom.
FIG. 3
shows a conventional heat dissipation device
20
. The heat dissipation device
20
comprises a flat base
22
, a plurality of fins
24
extending from the base
22
, and a fan
26
mounted on the fins
24
. During operation of the heat dissipation device
20
, the fan
26
draws ambient cooling air to the heat dissipation device
20
. The air flows down in grooves defined between the fins
24
for heat exchange with the fins
24
. When the air arrives at the base
22
, some of it simply refluxes instead of exiting from the groove. When the refluxed air meets downward flowing air, turbulence is created, and some of the downward flowing air is even prevented from entering the heat dissipation device. Thus an overall speed and efficiency of cooling airflow is retarded. This can seriously affect the heat dissipation capability of the heat dissipation device.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat dissipation device which provides smooth and substantially unencumbered airflow for good heat dissipation capability.
In order to achieve the object set out above, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat sink and a fan. The heat sink includes a base and a plurality of fins. The base has a first surface in thermal contact with the electronic package and a pair of sloped heat dissipation surfaces. The fins are perpendicularly attached on the heat dissipation surfaces. The fan is supported on the heat sink. During operation of the heat dissipation device, the cooling air is drawn into the heat sink by the fan and exits the heat sink along the heat dissipation surfaces.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:


REFERENCES:
patent: 5597034 (1997-01-01), Barker et al.
patent: 6196300 (2001-03-01), Checchetti
patent: 6382306 (2002-05-01), Hsu
patent: 6598667 (2003-07-01), Kuo
patent: 2003/0020327 (2003-01-01), Isono et al.

Affiliated with

Also associated with

Rating

Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3329569