Heat dissipation device

Details Heat dissipation device Heat dissipation device

2002-12-20

2004-06-08

Atkinson, Christopher (Department: 3743)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Plural intermediate fluent heat exchange materials

C165S080300, C165S121000, C165S104330, C165S185000, C361S697000, C361S700000, C257S715000, C257S722000, C174S015200, C174S016300

Reexamination Certificate

active

06745824

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to heat dissipation devices, and more particularly to a heat dissipation device which incorporates a vapor chamber and a plurality of heat pipes.
2. Description of Prior Art
During operation of many heat generating devices such as central processing units (CPUs), large amounts of heat are produced. Such heat must be quickly removed from the heat generating device, to prevent the heat generating device from becoming unstable or being damaged. Typically, a heat dissipation device is attached to an outer surface of a heat generating device to remove heat therefrom.
Referring to
FIG. 5
, a conventional heat dissipation device comprises a chassis
2
and a plurality of hollow fins
4
attached to the chassis
2
. The chassis
2
has a plurality of grooves
6
. The grooves
6
together with corresponding hollow fins
4
define vapor chambers, which accommodate working fluid
8
therein. In operation, the chassis
2
conductively absorbs heat from a heat-generating device. The working fluid
8
at evaporating ends of the chambers absorbs such heat, and is vaporized. The vapor flows to the hollow fins
4
where it condenses and releases latent heat. The condensed working fluid
8
then returns to the evaporating ends through wicking structures that provide capillary forces. However, convection of the working liquid
8
within the chassis
2
is often poor. As a result, the heat dissipation device cannot adequately dissipate heat from the heat-generating device.
Referring to
FIG. 6
, another conventional heat dissipation device
10
comprises a metal block
15
, a heat pipe
11
and a plurality of parallel fins
12
. The metal block
15
is directly mounted on an outer surface of a heat-generating device (not shown). One end of the heat pipe
11
is engaged in an aperture
13
of the metal block
15
, and an opposite end of the heat pipe
11
is extended through apertures
14
of the fins
12
to be in intimate thermal contact with the fins
12
. However, the thermal contact surface of both ends of the heat pipe is limited. Accordingly, the heat removal capability of the heat dissipation device is frequently not sufficient.
Thus, an improved heat dissipation device which can overcome the above-mentioned problems is strongly desired.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat dissipation device which incorporates a vapor chamber and a plurality of heat pipes to attain great heat removal capability.
Another object of the present invention is to provide a heat dissipation device having a simple and compact structure.
In order to achieve the objects set out above, a heat dissipation device of the present invention includes a heat sink, a plurality of heat pipes, a frame and a fan. Each heat pipe has a lower first connecting portion and an upper second connecting portion. The heat sink includes a base, and a plurality of parallel fins attached on the base. The base comprises a top plate, and defines a hermetically sealed chamber. A plurality of apertures is defined in one side wall of the base, the apertures receiving the first connecting portions of the heat pipes. A plurality of through holes is transversely defined through the plurality of fins of the heat sink, the through holes receiving the second connecting portions of the heat pipes. The frame includes an upper plate, and two side plates depending from the upper plate. A pair of arms depends from respective opposite ends of a bottom portion of each side plate, the arms securing the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate by phase transition. The working liquid also transfers heat to the second connecting portions of the heat pipes by phase transition.


REFERENCES:
patent: 3143592 (1964-08-01), August
patent: 5959837 (1999-09-01), Yu
patent: 6041850 (2000-03-01), Esser et al.
patent: 6230788 (2001-05-01), Choo et al.
patent: 6382307 (2002-05-01), Wang et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6542364 (2003-04-01), Lai et al.

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