Heat dissipation device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C165S104330, C165S121000, C257S718000, C257S719000, C361S697000, C361S719000

Reexamination Certificate

active

07394656

ABSTRACT:
A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least one first channel (18) is defined in the top surface. The fin assembly has a first bottom surface (32). At least one second channel (38) is defined in the first bottom surface corresponding to the at least one first channel. At least one indented portion (324) is defined in the first bottom surface. The at least one heat pipe is received in the first channel and the second channel, and attached through the fin assembly. At least one foot member is attached to the at least one indented portion of the fin assembly.

REFERENCES:
patent: 6915844 (2005-07-01), Chou
patent: 7100681 (2006-09-01), Wu et al.
patent: 7269014 (2007-09-01), Zhao et al.
patent: 7312994 (2007-12-01), Lee et al.
patent: 2005/0259405 (2005-11-01), He
patent: 2006/0028798 (2006-02-01), Wang
patent: 2007/0119566 (2007-05-01), Peng
patent: 2007/0217155 (2007-09-01), Zhao et al.
patent: 2007/0295487 (2007-12-01), Xia et al.
patent: 2008/0019094 (2008-01-01), Xia et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2815586

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.