Heat dissipation device

Details Heat dissipation device Heat dissipation device

2011-05-24

2011-05-24

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S709000, C361S719000, C257S719000, C257S722000, C174S016300, C174S252000, C165S080400, C165S080500, C165S104330, C024S453000, C024S458000, C024S459000, C024S520000

Reexamination Certificate

active

07948756

ABSTRACT:
A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component.

REFERENCES:
patent: 7167367 (2007-01-01), Zhang
patent: 7283362 (2007-10-01), Lin et al.
patent: 7336492 (2008-02-01), Yu
patent: 7385823 (2008-06-01), Desrosiers et al.
patent: 7385825 (2008-06-01), Xia et al.
patent: 7515419 (2009-04-01), Li et al.
patent: 2010/0108362 (2010-05-01), Du et al.

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