Heat dissipation device

Details Heat dissipation device Heat dissipation device

2008-05-06

2008-05-06

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S698000, C361S699000, C361S700000, C361S719000, C165S080400, C165S104210, C165S104330

Reexamination Certificate

active

07369412

ABSTRACT:
A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.

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The article: “Cooling System for Chip Carrier on Card”, IBM Technical Disclosure Bulletin, Sep. 1988, vol. 31, Issue 4, pp. 39-40.

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