Heat dissipation device

Details Heat dissipation device Heat dissipation device

2011-08-23

2011-08-23

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S104330

Reexamination Certificate

active

08004843

ABSTRACT:
A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.

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patent: 2006/0221576 (2006-10-01), Takano et al.
patent: 2009/0023647 (2009-01-01), Stegmann et al.

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