Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-07-17
2011-11-01
Hoffberg, Robert J (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S679480, C361S679520, C361S679540, C361S679550, C361S695000, C361S697000, C361S700000, C361S704000, C361S709000, C165S080200, C165S080300, C165S104330, C165S185000
Reexamination Certificate
active
08050038
ABSTRACT:
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
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Chen Chun-Chi
Liu Xin-Lei
Yang Hong-Cheng
Altis Law Group, Inc.
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Hoffberg Robert J
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