Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-07-17
2011-11-15
Hoffberg, Robert J (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S679480, C361S679520, C361S679540, C361S679550, C361S695000, C361S697000, C361S700000, C361S704000, C361S709000, C165S080200, C165S080300, C165S104330, C165S185000, C024S518000, C292SDIG016
Reexamination Certificate
active
08059410
ABSTRACT:
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.
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patent: 7990713 (2011-08-01), Liu et al.
patent: 2010/0258276 (2010-10-01), Chen et al.
Chen Chun-Chi
Kong Cheng
Nie Wei-Cheng
Yang Hong-Cheng
Altis Law Group, Inc.
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Hoffberg Robert J
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