Heat dissipation device

Details Heat dissipation device Heat dissipation device

2009-03-06

2011-12-06

Swann, Judy (Department: 3785)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080300, C165S185000, C361S700000

Reexamination Certificate

active

08069909

ABSTRACT:
A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.

REFERENCES:
patent: 5950444 (1999-09-01), Matsunaga
patent: 6111751 (2000-08-01), Sakuyama
patent: 6148906 (2000-11-01), Li et al.
patent: 7262965 (2007-08-01), Cheng
patent: 7408781 (2008-08-01), Chen
patent: 7746640 (2010-06-01), Cao et al.
patent: 2008/0142193 (2008-06-01), Li et al.
patent: 2008/0310122 (2008-12-01), Chou et al.
patent: 2009/0000768 (2009-01-01), Zheng et al.
patent: 2009/0166007 (2009-07-01), Li et al.

Affiliated with

Also associated with

Rating

Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4269639