Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-01-06
2011-11-15
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S694000, C361S719000
Reexamination Certificate
active
08059403
ABSTRACT:
A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.
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Chou Chia-Hsing
Shih Po-Wen
Wang Shang-Yi
ASUSTeK Computer Inc.
Jianq Chyun IP Office
Thompson Gregory
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