Heat dissipation device

Details Heat dissipation device Heat dissipation device

2008-02-13

2010-11-02

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C257S712000, C257S713000, C361S704000, C361S710000, C361S717000, C361S718000, C361S722000

Reexamination Certificate

active

07826227

ABSTRACT:
A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.

REFERENCES:
patent: 4485429 (1984-11-01), Mittal
patent: 5852548 (1998-12-01), Koon et al.
patent: 6223814 (2001-05-01), Moresco et al.
patent: 7144624 (2006-12-01), Knowles et al.
patent: 2009/0034197 (2009-02-01), Leija et al.
patent: 2009/0205807 (2009-08-01), Kim et al.

Affiliated with

Also associated with

Rating

Heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4248736