Heat dissipation assembly with retaining device

Details Heat dissipation assembly with retaining device Heat dissipation assembly with retaining device

2005-11-08

2005-11-08

Duong, Tho (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S067000, C257S718000, C257S719000

Reexamination Certificate

active

06962192

ABSTRACT:
A heat dissipation assembly includes a printed circuit board (70) with a heat-generating device (74) mounted thereon, a heat sink (60) mounted on the heat-generating device for dissipating heat therefrom, a retaining device (1) and a locating member (50). The retaining device includes a pair of spaced pressing portions (14) pressing on the heat sink, and a pair of pivot portions (34) pivotally engaged with the pressing portions respectively. The locating member includes a baseplate (52) located at an underside of the printed circuit board, and four pins (54) extending from the baseplate. The pins pass through the printed circuit board and the heat sink. Two of the pins are engaged by the pressing portions, and the other two pins are engaged by the pivot portions when the pivot portions are pivotally moved toward the printed circuit board.

REFERENCES:
patent: 5542468 (1996-08-01), Lin
patent: 5771960 (1998-06-01), Lin
patent: 5870288 (1999-02-01), Chen
patent: 6097601 (2000-08-01), Lee
patent: 6141220 (2000-10-01), Lin
patent: 6307747 (2001-10-01), Farnsworth et al.
patent: 6356446 (2002-03-01), Guerrero
patent: 6449154 (2002-09-01), Yoneyama et al.
patent: 6480384 (2002-11-01), Lo
patent: 6731506 (2004-05-01), Dong et al.
patent: 2004/0017662 (2004-01-01), Liu
patent: 2004/0156171 (2004-08-01), Dong et al.
patent: 385885 (2000-03-01), None
patent: 398641 (2000-07-01), None
patent: 471652 (2002-01-01), None
patent: 519256 (2003-01-01), None
patent: 539391 (2003-06-01), None

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