Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-08-02
2005-08-02
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S718000, C257S727000, C174S016300, C165S080300, C165S185000
Reexamination Certificate
active
06924982
ABSTRACT:
A heat dissipation assembly (100) includes a retention frame (90), a heat sink (80), a fan holder (10), a pair of clips (60) and a fan (20). The heat sink is mounted on the retention frame and forms a pair of shoulders (822) at opposite sides thereof. The fan holder includes a fan duct (40) surrounding a top portion of the heat sink and including a pair of supports mounted on the shoulders, and a holding frame (30) detachably mounted on the fan duct. The clips are mounted on the supports and engaged with the retention frame. One side of the holding frame is pivotally engaged with the fan duct, an opposite side of the holding frame forms a latching leg (33) that is engaged with an ear (412) formed at the fan duct. Three catching arms extend from the holding frame and retain the fan in the holding frame.
REFERENCES:
patent: 5519574 (1996-05-01), Kodama et al.
patent: 5590025 (1996-12-01), Clemens
patent: 6407919 (2002-06-01), Chou
patent: 6520250 (2003-02-01), Lee et al.
patent: 6717814 (2004-04-01), Li
patent: 6798663 (2004-09-01), Rubenstein
patent: 6822864 (2004-11-01), Huang et al.
patent: 6860321 (2005-03-01), Ji-Hai et al.
patent: 2002/0121358 (2002-09-01), Lee
patent: 478723 (2002-03-01), None
patent: 491501 (2002-06-01), None
patent: 493770 (2002-07-01), None
patent: 511883 (2002-11-01), None
Chen Chun-Chi
Fu Meng
Lan Chin Hsien
Chervinsky Boris
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
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